Mikrotek Machines Ltd offers the WPF 2S wire-polishing machine with a fine automatic double spindle. It has a size range of up to 0.8mm. The machine was designed and developed for polishing natural, monocrystalline and polycrystalline diamond dies, which are essential components for drawing wires. It is a high-speed machine, with individual controls, tension adjustment and die oscillation.
Areas of Expertise:
Drawing Dies, Extruder Screws Crossheads & Other Wear Parts
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